Tile and Stone Technologies™ Copper Resin Hybrid Pads

These pads represent the next level in polishing performance.

The hybrid copper-resin bond cuts faster and lasts longer than traditional resin polishing pads. The outer ring features a copper-resin hybrid designed for maximum speed and extended life, while the inner ring is made from our highest-quality resin and diamond matrix to refine the surface and remove swirl patterns left by the copper.

Ideal for flat-edge polishing, surface polishing, and scratch repair.

• For wet-use on angle grinders
• Optimized for use on Engineered Stone, Granite, Quartzite, Marble, and Porcelain
• Available in 4" diameter, 30-grit through 3000-grit
• Color-coded for quick referencing
• Hook & Loop interface